輕觸開關, 按鍵開關,滑動開關,撥動開關,檢測開關,等開關產品的注意事項與使用條件。 4. Precaution注意事項 4.1 Soldering condition 浸焊條件 ITEM項目 CONDITION條件 Preheat temperature 預熱溫度 110oC max (Embilomental temperature of soldering surface of P. W. E) 110oC 以下(印刷基板焊錫面周圍的溫度) Preheat time 預熱時間 60 sec, max 60 秒以內 Area of flux 助焊劑的面積 1/2 max of P. W. B. thickness 印刷基板厚度的1/2 以內 Temperature of solder 焊錫溫度 255oC max 255oC 以下 Time of immersion 浸焊時間 Within 5 sec 5 秒以內 Soldering number 浸焊次數 Within 2 times (But should bring down heat of the first soldering) 2 次以內 (但應把第一次焊錫的溫度降下來) Printed wiring board 印刷基板 Single sided copper-clad laminates 單面銅箔(1) After switches were soldered, please be careful not to clean switches with solvent 開關浸焊后,注意不要用溶劑清洗. (2) In the case of using soldering iron, soldering conditions shall be 280oC max and 3 sec. max 在使用鉻鐵的情況下,焊錫溫度應在300oC 以下、3 秒以內. (3) Right after switches were soldered; please be careful not to load on the knobs of switches. 浸焊后,注意不要在頂部施加負荷. 4. 2 Design instructions(設計中應注意的事項) (1) Follow recommended P. W. B. piercing plan in outside drawing page. 印刷基板的安裝孔尺寸參見產品圖. (2) Design key top as fig. Design inclination of key top 4 deg. max as fig. (Recommended operating condition.) 擊鍵部設計如圖,擊鍵部傾斜度如圖在4 度以內. (參見操作條件). 4.3 Note(注意點) (1) Please be cautious not to give excessive static load or shock to switches. 注意不要施加超負荷的壓力或晃動開關. (2) Please be careful not to pile up P. W. B. after switches were soldered. 開關焊接以后,印刷基板注意不要疊放. (3) Preservation under high temperature and high humidity or corrosive gas should be avoided especially. When you need to preserve for a long period, do not open the carton. 保管時尤其應注意避開高濕高溫和有腐蝕性氣體的環境.如需長時間保存,請不要打開包裝箱. (4) Panasert RH and RH6 shall be used as the standard insert machine (use N type clinch). 使用標準插入機器PANASERT 和RH6（使用N 式釘） (5) Preservation under high temperature and high humidity or corrosive gas should be avoided especially, when you need to preserve for a long period, do not open the carton. 特別注意避免將產品保存在高溫、強溫度或有腐蝕性氣體的地方。若長期保存，請勿打開包裝箱。